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 SGM321 SGM358 SGM324
PRODUCT DESCRIPTION
The SGM321(single), SGM358(dual) and SGM324(quad) are rail-to-rail input and output voltage feedback amplifiers offering low cost. They have a wide input common-mode voltage range and output voltage swing, and take the minimum operating supply voltage down to 2.1V and the maximum recommended supply voltage is 5.5 V. All are specified over the extended - 40C to +85C temperature range. The SGM321/358/324 provide 1MHz bandwidth at a low current consumption of 60A per amplifier. Very low input bias currents of 10pA, enable SGM321/358/ 324 to be used for integrators, photodiode amplifiers, and piezoelectric sensors. Rail-to-rail inputs and outputs are useful to designers buffering ASIC in single-supply systems. Applications for the series amplifiers include safety monitor- ing, portable equipment, battery and power supply control, and signal conditioning and interfacing for transducers in very low power systems. The SGM321 is available in SOT23-5 and SC70-5 packages. The SGM358 comes in SO-8MSOP-8 and PDIP-8 packages. The SGM324 is offered in SO-14, TSSOP-14, TSSOP-16 and SO-16 packages.
1MHz, 60A, Rail-to-Rail I/O CMOS Operational Amplifier
FEATURES
* Low Cost * Rail-to-Rail Input and Output 0.8mV Typical VOS * Unity Gain Stable * Gain Bandwidth Product: 1MHz * Very Low Input Bias Currents: 10pA * Operates on 2.1 V to 5.5 V Supplies * Input Voltage Range: - 0.1 V to +5.6 V with VS = 5.5 V * Low Supply Current: 60A/Amplifier * Small Packaging SGM321 Available in SOT23-5 and SC70-5 SGM358 Available in SO-8, MSOP-8 and PDIP-8 SGM324 Available in SO-14, SO-16, TSSOP-14 and TSSOP-16
PIN CONFIGURATIONS (Top View)
SGM321
OUT A 1 +IN 1 5 +VS -INA 2 -VS 2 +INA 3 -IN 3 4 OUT -VS 4
SGM358
8 7 +VS OUT B
6 -INB 5 +INB
SOT23-5 / SC70-5
SO-8 / MSOP-8 / PDIP-8
APPLICATIONS
ASIC Input or Output Amplifier Sensor Interface Piezo Electric Transducer Amplifier Medical Instrumentation Mobile Communication Audio Output Portable Systems Smoke Detectors Notebook PC PCMCIA cards Battery -Powered equipment DSP interface
OUT A -IN A +IN A +VS +INB -INB OUT B NC 1 2 3 4 5 6 7 8
SGM324
16 OUT D 15 -IND 14 +IND 13 -VS 12 +INC 11 -INC 10 OUT C
NC = NO CONNECT
SGM324
OUT A -IN A +IN A +VS +INB -INB OUT B 1 2 3 4 5 6 7 14 OUT D 13 -IND 12 +IND 11 -VS 10 +INC 9 8 -INC OUT C
9
NC
TSSOP-16 / SO-16
TSSOP-14/SO-14
Shengbang Microelectronics Co, Ltd Tel: 86/451/84348461 www.sg-micro.com
REV. D
ELECTRICAL CHARACTERISTICS : VS = +5V
(At RL = 100k connected to Vs/2,and VOUT = Vs/2, unless otherwise noted)
SGM321/358/324 PARAMETER CONDITION TYP +25 INPUT CHARACTERISTICS Input Offset Voltage (VOS) Input Bias Current (IB) Input Offset Current (IOS) Common-Mode Voltage Range (VCM) Common-Mode Rejection Ratio(CMRR) Open-Loop Voltage Gain( AOL) Input Offset Voltage Drift (VOS/T) OUTPUT CHARACTERISTICS Output Voltage Swing from Rail Output Current (IOUT) POWER SUPPLY 2.1 5.5 Power Supply Rejection Ratio (PSRR) Quiescent Current / Amplifier (IQ) DYNAMIC PERFORMANCE Gain-Bandwidth Product (GBP) Slew Rate (SR) Settling Time to 0.1%( tS) Overload Recovery Time NOISE PERFORMANCE Voltage Noise Density (en) f = 1kHz f = 10kHz 27 20 nV/ nV/
Hz Hz
MIN/MAX OVER TEMPERATURE +25 -40 to 85 UNITS MIN / MAX
0.8 10 10 VS = 5.5V VS = 5.5V, VCM = - 0.1V to 4 V VS = 5.5V, VCM = - 0.1V to 5.6 V RL = 5K ,Vo = 0.1V to 4.9V RL =100K ,Vo = 0.035V to 4.965V - 0.1 to + 5.6 70 68 80 84 2.7
5
5.6
mV pA pA V
MAX TYP TYP TYP MIN MIN MIN MIN TYP
62 56 70 80
62 55 70 80
dB dB dB dB V/
RL = 100K RL = 10K
0.008 0.08 23 20 18.8
V V mA
TYP TYP MIN
Operating Voltage Range Vs = +2.5 V to + 5.5 V VCM = (-VS) + 0.5 IOUT = 0 CL = 100pF 1 G = +1 , 2V Output Step G = +1, 2 V Output Step VIN *Gain = Vs 0.52 5.3 2.6 82 60
2.5 5.5 58 86
V V dB A
MIN MAX MIN MAX
60 80
MHz V/s s s
TYP TYP TYP TYP
TYP TYP
Specifications subject to change without notice.
SGM321/358/324
PACKAGE/ORDERING INFORMATION
MODEL SGM321 ORDER NUMBER SGM321YC5/TR SGM321YN5/TR SGM358YS/TR SGM358 SGM358YMS/TR SGM358YP SGM324YS/TR SGM324 SGM324YTS/TR SGM324YS14/TR SGM324YTS14/TR PACKAGE DESCRIPTION SC70-5 SOT23-5 SO-8 MSOP-8 PDIP-8 SO-16 TSSOP-16 SO-14 TSSOP-14 PACKAGE OPTION Tape and Reel, 3000 Tape and Reel, 3000 Tape and Reel, 2500 Tape and Reel, 3000 Tube, 50 Tape and Reel, 2500 Tape and Reel, 3000 Tape and Reel, 2500 Tape and Reel, 3000 MARKING INFORMATION 321 321 SGM358YS SGM358YMS SGM358YP SGM324YS SGM324YTS SGM324YS14 SGM324YTS14
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, V+ to V- . . . . . . . . . . . . . . . . . . . . . 7.5 V Common-Mode Input Voltage . . . . . . . . . . . . . . . . . . . . (-VS) - 0.5 V to (+VS )+0.5V Storage Temperature Range . . . . . . . . .-65 to +150 Junction Temperature . . . . . . . . . . . . . . . .. . . . . . . .160 Operating Temperature Range . . . . . . . -45 to +85
Package Thermal Resistance @ TA = 25 SC70-5, JA................................................................ 333/W SOT23-5, JA.............................................................. 190/W SO-8, JA......................................................................125/W MSOP-8, JA.............................................................. 216/W SO-16, JA..................................................................... 82/W TSSOP-16, JA............................................................ 105/W Lead Temperature Range (Soldering 10 sec)
CAUTION
This integrated circuit can be damaged by ESD. Shengbang Micro-electronics recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
.....................................................260
ESD Susceptibility HBM................................................................................4000V MM....................................................................................400V
NOTES 1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
SGM321/358/324
TYPICAL PERFORMANCE CHARACTERISTICS
At TA = +25, VS = +5V, and RL = 100k connected to Vs/2,unless otherwise noted. Small-Signal Step Response
G = +1 CL = 100pF RL = 100K
Large-Signal Step Response
G = +1 CL = 100pF RL = 100K
20mV/div
2s/div
500mV/div
10s/div
Small-Signal Overshoot vs.Load Capacitance
Small-Signal Overshoot vs.Load Capacitance 60 Small-Signal Overshoot(%) 50 40 30 20 10 0 G = +1 RL = 100K G = -1 RFB = 5K G = -1 RFB = 100K
60 Small-Signal Overshoot(%) 50 40 30 20 10 0 10 100 1000 Load Capacitance(pF) 10000
G = -5 RFB = 100K
10
100 1000 Load Capacitance(pF)
10000
Maximum Output Voltage vs.Frequency 6 5 Output Voltage(Vp-p) 4 3 2 1 0 1 10 100 1000 Frequency(kHz) 10000 VS = 2.5V VS = 5V
Maximum Output Voltage Without Slew-Rate Induced Distortion
50
Quiescent And Short-Circuit Current vs.Supply Voltage 30 25 Short-Circuit Current(mA)
VS = 5.5V
Quiescent Current(A) 45 40 35 30 25 2 2.5 3 3.5 4 4.5 Supply Voltage(V) 5 5.5
IQ ISC
20 15 10 5
SGM321/358/324
TYPICAL PERFORMANCE CHARACTERISTICS
At TA = +25, VS = +5V, and RL = 100k connected to Vs/2,unless otherwise noted.
Input Voltage Noise Spectral Density vs.Frequency
CMRR And PSRR vs.Frequency 100 90 80 CMRR,PSRR(dB) 70 60 50 40 30 20 10 0 0.01 0.1 1 10 100 Frequency(kHz) 1000 10000 PSRR CMRR
1000
Voltage Noise(nV/Hz)
100
10 0.01
0.1
1 Frequency(kHz)
10
100
Output Voltage Swing vs.Output Current 3 135 Output Voltage(V) 2 VS = 3V 1 -50 25 135 Sinking Current 0 0 4 8 12 16 20 Output Current(mA) Sourcing Current -50 Output Voltage(V) 25 4 3 2 1 5
Output Voltage Swing vs.Output Current 135 VS = 5V -50 Sourcing Current
25
Sinking Current -50 135 25 15 20 25 30
0 0 5 10 Output Current(mA)
Supply Current vs.Temperature 60 55 50 45 40 35 30 -50 -30 -10 10 30 50 70 Temperature() 90 110 130 VS = 2.5V
Open-Loop Gain vs.Temperature 120 110 Open-Loop Gain(dB) RL = 5k RL = 100k
Supply Current(A)
VS = 5V VS = 3V
100 90 80 70 60 -50 -30 -10 10 30 50 70 Temperature() 90 110 130
SGM321/358/324
TYPICAL PERFORMANCE CHARACTERISTICS
At TA = +25, VS = +5V, and RL = 100k connected to Vs/2,unless otherwise noted.
Common-Mode Rejection Ratio vs.Temperature 120 110 100 CMRR(dB) 90 80 70 60 -50 -30 -10 10 30 50 70 Temperature() 90 110 130
PSRR(dB) 120 Power-Supply Rejection Ratio vs.Temperature
-Vs < VCM < (+Vs)-1.5V
110 100
-Vs < VCM <(+Vs)
90 80 70 60 -50 -30 -10 10 30 50 70 Temperature() 90 110 130
Overload Recovery Time
Vs = 5V G = -5 VIN = 500mV
2.5V
0V 500mV 0V
Time(2s/div)
SGM321/358/324
APPLICATION NOTES
Driving Capacitive Loads
The SGM3XX can directly drive 250pF in unity-gain without oscillation. The unity-gain follower (buffer) is the most sensitive configuration to capacitive loading. Direct capacitive loading reduces the phase margin of amplifiers and this results in ringing or even oscillation. Applications that require greater capacitive drive capability should use an isolation resistor between the output and the capacitive load like the circuit in Figure 1. The isolation resistor RISO and the load capacitor CL form a zero to increase stability. The bigger the RISO resistor value, the more stable VOUT will be. Note that this method results in a loss of gain accuracy because RISO forms a voltage divider with the RLOAD.
Power-Supply Bypassing and Layout
The SGM3XX family operates from either a single +2.5V to +5.5V supply or dual 1.25V to 2.75V supplies. For single-supply operation, bypass the power supply VDD with a 0.1F ceramic capacitor which should be placed close to the VDD pin. For dual-supply operation, both the VDD and the VSS supplies should be bypassed to ground with separate 0.1F ceramic capacitors. 2.2F tantalum capacitor can be added for better performance.
VDD VDD 10F
10F 0.1F
0.1F
RISO
SGM321
VOUT CL
Vn Vn
SGM321
VIN
VOUT
SGM321
VOUT 10F
Vp
Figure 1. Indirectly Driving Heavy Capacitive Load An improvement circuit is shown in Figure 2, It provides DC accuracy as well as AC stability. RF provides the DC accuracy by connecting the inverting signal with the output, CF and RIso serve to counteract the loss of phase margin by feeding the high frequency component of the output signal back to the amplifier's inverting input, thereby preserving phase margin in the overall feedback loop.
Vp
VSS(GND)
0.1F
VSS
Figure 3. Amplifier with Bypass Capacitors
CF RF RISO
SGM321
VOUT CL RL
VIN
Figure 2. Indirectly Driving Heavy Capacitive Load with DC Accuracy For no-buffer configuration, there are two others ways to increase the phase margin: (a) by increasing the amplifier's gain or (b) by placing a capacitor in parallel with the feedback resistor to counteract the parasitic capacitance associated with inverting node.
SGM321/358/324
Typical Application Circuits
Differential Amplifier
The circuit shown in Figure 4 performs the difference function. If the resistors ratios are equal ( R4 / R3 = R2 / R1 ), then VOUT = ( Vp - Vn ) x R2 / R1 + Vref.
C R2 R1 VIN
SGM321
R2 Vn Vp R3 R4 Vref
Figure 4. Differential Amplifier
VOUT
R1
SGM321
VOUT
R3 = R1 // R2
Figure 6. Low Pass Active Filter
Instrumentation Amplifier
The circuit in Figure 5 performs the same function as that in Figure 4 but with the high input impedance.
R2 R1
SGM321
Vn
SGM321
VOUT
Vp
SGM321
R3
R4
Vref
Figure 5. Instrumentation Amplifier
Low Pass Active Filter
The low pass filter shown in Figure 6 has a DC gain of ( - R2 / R1 ) and the -3dB corner frequency is 1/2R2C. Make sure the filter is within the bandwidth of the amplifier. The Large values of feedback resistors can couple with parasitic capacitance and cause undesired effects such as ringing or oscillation in high-speed amplifiers. Keep resistors value as low as possible and consistent with output loading consideration.
SGM321/358/324
PACKAGE OUTLINE DIMENSIONS
SC70-5
D e1 e L
Symbol
A A1 A2
Dimensions In Millimeters Min
0.900 0.000 0.900 0.150 0.080 2.000 1.150 2.150 1.200 0.260 0
Dimensions In Inches Min
0.035 0.000 0.035 0.006 0.003 0.079 0.045 0.085 0.047 0.010 0
Max
1.100 0.100 1.000 0.350 0.150 2.200 1.350 2.450 1.400 0.460 8
Max
0.043 0.004 0.039 0.014 0.006 0.087 0.053 0.096 0.055 0.018 8
E1
E
b c D
L1
b A1 C
0.20
E E1 e e1
0.650TYP 0.525REF
0.026TYP 0.021REF
A2
A
L L1
SGM321/358/324
PACKAGE OUTLINE DIMENSIONS
SOT23-5
D b L
0
0.20
Symbol
A A1
Dimensions In Millimeters Min
1.050 0.000 1.050 0.300 0.100 2.820 1.500 2.650 1.800 0.300 0
Dimensions In Inches Min
0.041 0.000 0.041 0.012 0.004 0.111 0.059 0.104 0.071 0.012 0
Max
1.250 0.100 1.150 0.400 0.200 3.020 1.700 2.950 2.000 0.600 8
Max
0.049 0.004 0.045 0.016 0.008 0.119 0.067 0.116 0.079 0.024 8
E1
A2 b c
E
L
e e1 A1
D
C
E E1 e e1
0.950TYP 0.700REF
0.037TYP 0.028REF
A2
L L1
A
SGM321/358/324
PACKAGE OUTLINE DIMENSIONS
SO-8
D C
Symbol
L
Dimensions In Millimeters Min Max
1.750 0.250 1.550 0.510 0.250 5.000 4.000 6.300 1.270 8 1.350 0.100 1.350 0.330 0.190 4.780 3.800 5.800 0.400 0
Dimensions In Inches Min
0.053 0.004 0.053 0.013 0.007 0.188 0.150 0.228 0.016 0
Max
0.069 0.010 0.061 0.020 0.010 0.197 0.157 0.248 0.050 8
A A1
E1 E
A2 B C D
e
E E1 e
A1
1.270TYP
0.050TYP
B A2
L
A
SGM321/358/324
PACKAGE OUTLINE DIMENSIONS
MSOP-8
b
C
Symbol
A A1 A2 b c D e E E1 L
Dimensions In Millimeters Min Max
0.800 1.200 0.000 0.200 0.760 0.970 0.30 TYP 0.15 TYP 2.900 3.100 0.65 TYP 2.900 3.100 4.700 5.100 0.410 0.650 0 6
Dimensions In Inches Min Max
0.031 0.047 0.000 0.008 0.030 0.038 0.012 TYP 0.006 TYP 0.114 0.122 0.026 TYP 0.114 0.122 0.185 0.201 0.016 0.026 0 6
E1
E
e
D
A1
L
A2 A
SGM321/358/324
PACKAGE OUTLINE DIMENSIONS
PDIP-8
E1 e A A2
L
A1
Symbol
A A1 A2 B B1 C D E E1 e L E2
Dimensions In Millimeters Min Max
3.710 4.310 0.510 3.200 3.600 0.380 0.570 1.524(BSC) 0.204 0.360 9.000 9.400 6.200 6.600 7.320 7.920 2.540(BSC) 3.000 3.600 8.400 9.000
Dimensions In Inches Min Max
0.146 0.170 0.020 0.126 0.142 0.015 0.022 0.060(BSC) 0.008 0.014 0.354 0.370 0.244 0.260 0.288 0.312 0.100(BSC) 0.118 0.142 0.331 0.354
B B1 D
E2
E
C
SGM321/358/324
PACKAGE OUTLINE DIMENSIONS
SO-14
D
R1 1
L2
R
L
L1
INDEX 0.80.1 DEP0.20.1
Symbol
A A1 A2 A3 b b1 c c1 D E E1 e L L1 L2 R R1 h 1 2 3 4
Dimensions In Millimeters MIN NOM MAX
1.35 0.10 1.25 0.55 0.36 0.35 0.16 0.15 8.53 5.80 3.80 0.45 1.60 0.15 1.45 0.65 0.40 1.75 0.25 1.65 0.75 0.49 0.45 0.25 0.25 8.73 6.20 4.00
2
E1
E
2.00.1 BTM E-MARK DEP0.10.05
h
h e b
0.25
BB
M
3 A2 A A3
A1
4 b
0.10
0.20 8.63 6.00 3.90 1.27 BSC 0.60 0.80 1.04 REF 0.25 BSC
BASE METAL
b1
WITH PLATING
0.07 0.07 0.30 0 6 6 5 5
0.40 8 8 7 7
0.50 8 10 10 9 9
c1
c
SECTION B-B
SGM321/358/324
PACKAGE OUTLINE DIMENSIONS
SO-16
D C
Symbol
A A1 A2 b c D E E1 e L
E1 E
Dimensions In Millimeters Min Max
1.350 1.750 0.100 0.250 1.350 1.550 0.330 0.510 0.170 0.250 9.800 10.20 3.800 4.000 5.800 6.200 1.270 (BSC) 0.400 1.270 0 8
Dimensions In Inches Min Max
0.053 0.069 0.004 0.010 0.053 0.061 0.013 0.020 0.007 0.010 0.386 0.402 0.150 0.157 0.228 0.244 0.050 (BSC) 0.016 0.050 0 8
L e A2 A1 b A
SGM321/358/324
PACKAGE OUTLINE DIMENSIONS
TSSOP-14
D
Symbol
A
2 S
Dimensions In Millimeters MIN
-- 0.05 0.90 0.34 0.20 0.20 0.10 0.10 4.86 6.20 4.30 0.45
NOM
-- -- 1.00 0.44 -- 0.22 -- 0.13 4.96 6.40 4.40 0.65 BSC 0.60 1.00 REF 0.25 BSC
MAX
1.20 0.15 1.05 0.54 0.28 0.24 0.19 0.15 5.06 6.60 4.50 0.75
A1 A2 A3 b b1 c
3
R1 R B
E1
E
B
L2
INDEX 1.00.05 0.1-0.1 DEP
+0
L L1
1
c1 D E E1
#1 PIN
e
BASE METAL
b b1 A3
e L L1 L2 R 0.09 0.09 0.20 0 10 10 R1 S 1 2 3
A2
A
A1
c1
c
-- -- -- -- 12 12
-- -- -- 8 14 14
0.10
SECTION B-B
SGM321/358/324
PACKAGE OUTLINE DIMENSIONS
TSSOP-16
A b
Symbol
E1 E
Dimensions In Millimeters Min Max
5.100 4.500 0.300 0.200 6.550 1.100 0.800 1.000 0.020 0.150 0.65 (BSC) 0.500 0.700 0.25(TYP) 1 7 4.900 4.300 0.190 0.090 6.250
Dimensions In Inches Min Max
0.193 0.169 0.007 0.004 0.246 0.201 0.177 0.012 0.008 0.258 0.043 0.031 0.039 0.001 0.006 0.026 (BSC) 0.020 0.028 0.01(TYP) 1 7
PIN #1 IDENT. e A2 A
C D L H A1
A
D E b c E1 A A2 A1 e L H
SGM321/358/324
REVISION HISTORY
Location Page
11/06-- Data Sheet changed from REV.A to REV.B Changes to ABSOLUTE MAXIMUM ATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 04/07-- Data Sheet changed from REV.B to REV.C Adds Output Voltage Swing from Rail test condition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 06/07-- Data Sheet changed from REV.C to REV. D Adds SO-14 and TSSOP-14 Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1, 3, 14, 16
Shengbang Microelectronics Co, Ltd
Unit 3, ChuangYe Plaza No.5, TaiHu Northern Street, YingBin Road Centralized Industrial Park Harbin Development Zone Harbin, HeiLongJiang 150078 P.R. China Tel.: 86-451-84348461 Fax: 86-451-84308461 www.sg-micro.com
SGM321/358/324


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